Parameter control for lamination four-layer board with finished thickness of 0.3mm.
Items requires lightweight, thin, and small size
Backplane bonding design to achieve a blind via effect.
Products with embedded component needs or special thickness requirements. For example: optical products, CMOS, RFID, and small-sized products.
Multi-layer board copper thickness: 6oz for inner layers / 6oz for outer layers.
Power-related boards or products with high-speed heat dissipation requirements.
Inductor circuit board
Wireless, communication devices, wireless charging devices.
Through a special process, copper is plated on the half holes along the board edge.
Functional requirements on the PCB edges (connection/welding) corresponding to specific products
Flexible use of legend processes, printing customer part number,barcode on break edges (non-sequential number).
Barcode optimization for non-sequential products, saving customer labeling process time.
Requirements for composite SMD (Surface Mount Device).
increase copper thickness according to PAD positions, forming a copper surface height difference (1~3oz) resembling copper columns, achieving cost reduction and improved heat dissipation.
Power-related, communication equipment, automotive equipment.
BGA routing with a pitch spacing of 0.4mm (without drilled holes).
High-frequency substrate/gold fingers (G/F tip w/o conductive wire ).
High-frequency products, 50G, 100G+, high transmission speed products. Example industries: optical fiber, communication, automotive.
Double-sided PCB - finished thickness of 0.18mm.
Product application: Medical equipment - blood glucose meters.
Inner layers: 4oz / Outer layers: 4oz / Inductor design / Transparent solder mask.
Product application: Network communication - resonators.
Double-sided board - finished thickness of 0.2mm.
SD cards, wearable products.
