| Items | Manufacturing Capability | |
|---|---|---|
| Material | FR-4 (Tg140~180) | YES |
| FR-5 (Tg180) | YES | |
| Halogen free | YES | |
| High Frequency (Low Dk/Df ) | Isola / Rogers / Panasonic / Tuc / Nan-Ya | |
| MCPCB (Metal Core) | Aluminum Metal core | |
| General Design | General Design | ≦ 16 Layers |
| HDI Stagger | Typical: (1+n+1) / Advanced: (2+n+2) | |
| Finished Thickness | 0.20mm~3.2mm | |
| MechnicalDrill & LaserDrill | PTH Hole | ≧0.10mm |
| Slot | Typical: ≧0.40mm / Advanced: 0.35mm | |
| Min. Hole to Hole Spec | ≧8.0mil | |
| Min.Copper to Conductor | Typical: ≧4.0mil / Advanced: 3.0mil | |
| Finished Hole Size(VIP) | Typical:≧0.15mm / Advanced: 0.10mm | |
| Min. Hole Size (Laser) | 0.10mm | |
| Aspect Ratio (Mechanical) | Typical: ≦8 / Advanced: 10 | |
| Aspect Ratio (Laser) | Typical: ≦0.66 / Advanced: 0.8 | |
| Plating | Board Thickness ： Via Aspect Ratio | Typical: ≦8：1 / Advanced: 10：1 |
| Min. Board Thickness | 0.１mm | |
| InnerLayer | Min. Line / Space | 3.0 / 3.0 mil (1oz) |
| Core Thickness | 3.0 mil (H/H) | |
| Copper Thickness | ≦6.0oz | |
| Impedance Control | 25Ω~120Ω | |
| Impedance Tolerance | ±10% | |
| OuterLayer | Min. Line/Space | Typical: 3.0/3.0 mil / Advanced: 2.5/3.0mil |
| Min. BGA Diameters | 6.0mil | |
| Min. BGA Ball Pitch | Typical: 0.50mm / Advanced: 0.35mm | |
| Copper Thickness | 1oz ~ 6oz | |
| Impedance Control | 25Ω~120Ω | |
| Impedance Tolerance | ±10% | |
| Outer Copper Final oz | Finishd 1oz Min:(Line/Space) | Line 3mil / Space 3mil |
| Finishd 2oz Min:(Line/Space) | Line 3mil / Space 5mil | |
| Finishd 3oz Min:(Line/Space) | Line 6mil / Space 8mil | |
| Soldermask | Tolerance | ± 0.8mil |
| Final.Inspec | Dimension | ± 0.1mm |
| V-Cut depth | 1/3 Thickness | |
| V-Cut deviation | ±0.1mm | |
| Warpage | ≦0.75% | |
| Surface Treatment | ENIG / Electroplated gold / ENEPIG / Immer Sn / Immer Ag / OSP / HASL / Golden-Finger( Roof-Less) | |
