Sales Dept.

Sales Dept.

Provide quotes

Accept orders

Order review

Invoice preparation

Engineering Dept.

Engineering Dept.

File reception

Process design

Process Design Film

Output Program

production Dept.

production Dept.

ERP Process scheduling

Production manufacturing

Quality control

Packaging and shipping

品管部

Quality Assurance Dept.

Quality management systems

Technical quality support

Quality and Accuracy Standards

IPQC / OQC

Multi-Layer PCB

Lamination

  • Black / Brown oxide treatment

  • Stacks Layers

  • Lamination

  • X-Ray Target hole

  • CNC Edge grinding

Double Layer PCB

Drilling

  • Board Stacking

  • Pin

  • Drilling

  • Board grinding

Plating through hole

  • Deburr

  • Desmear

  • Chemical Copper Plating

  • Copper Plating

Pattern developing

  • Pre-treatments

  • Film lamination

  • Image Transfer

  • Image Development

Copper Plating

  • Copper plating、Tin-Lead Plating

  • Strip film

  • Etching

  • Strip TinLead

Electroplated Gold

  • Nickel Plating

  • Gold Plating

  • Strip film

  • Etching

QC inspection

  • O/S Test

  • appearance inspection

Solder Mask

  • Pretreatments

  • Coating

  • Prebaking

  • Exposure

  • Developing

  • Postbaking

HASL(Hot-Air Solder Leveling)

  • Surface pretreatment

  • flux

  • Hot-Air Solder Leveling

  • Cleaning

Immersion Gold

  • Surface pretreatment

  • Chemical Nickel plating

  • Immersion Gold

  • Cleaning

Legend

  • Printing legend

  • Baking

Forming

  • CNC milling

  • V-Cut

  • Beveling

Final Inspection

  • Cleaning

  • O/S Test

  • Hole inspection

  • appearance inspection

  • warpage check

ENTEK

Qualict Assurance

  • Visual inspection sampling

  • Impedance measurement

  • Microsection analysis

  • Shipment inspection report

  • Certificate of compliance / approval

Storage

  • Temp. & Humidity control

Packaging and Shipping

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